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How to Install AMPMODU PC Board Connectors

This guide provides detailed instructions for preparing PC boards, placing, soldering, and cleaning AMPMODU Mod II and Mod IV Printed Circuit Board Connectors for both through-hole and surface mount applications.

Estimated time: 1h

1. Prepare the PC Board

   Ensure the PC board material is glass epoxy (IPC 4101/26/83 or equivalent) with a thickness between 1.40 mm and 2.40 mm. Verify the maximum bow of the PC board does not exceed 0.03 mm over the length of the connector. Prepare all connector holes according to the requirements specified in Figure 7 of the product documentation.

2. Place the Connector onto the PC Board

   For Through-Hole Connectors: Align the contact solder leads with the matching holes on the PC board and firmly seat the connector housing onto the board. For additional retention before soldering, bend the contact solder leads outward (away from the center) as shown in Figure 8. For Surface Mount Technology (SMT) Connectors: Position the connector on the PC board. If the connector has hold-downs, ensure they are press-fit to secure the connector. Ensure the housing is fully seated on the PC board. If using robotic equipment, ensure it has a true position accuracy tolerance of 0.25 mm. For through-hole applications, use a support plate (Figure 16) to prevent PC board bowing and lead deformation during placement.

3. Apply Solder Paste and Mask (SMT Only)

   Apply solder mask between all lands and over any traces in the hold-down area. Liquid photo imageable or dry film solder masks are recommended. Using a stencil, apply 99.8 Sn lead-free RMA type solder paste to the circuit lands. Ensure solder paste thickness is 0.20 mm and volume is 0.18 mm³ per contact solder lead.

4. Prevent Solder Bridging and Wicking (Through-Hole Wave Soldering Only)

   To prevent solder bridging across leads, interrupt copper lands between leads by etching, plugging, tapping, or masking the area (Figure 10). To prevent flux/solder wicking into receptacle contacts, use masking plugs, liquid solder mask (applied with a brush), or masking tape (3.18 mm for Mod II, 1.59 mm for Mod IV) firmly applied between leads on the bottom of the PC board. Do not reuse tape.

5. Solder the Connector

   For Through-Hole Connectors (Wave Soldering): Perform wave soldering, ensuring the solder leads are bottomed on the PC board. For SMT Connectors (Reflow Soldering): Use vapor phase reflow (VPR) or non-focused infrared (IR) soldering equipment. For VPR, use a primary vapor temperature of 215 C, preheat for 30 seconds, dwell for 60 seconds, and cool down for 30 seconds. For IR, adjust conveyor speed (e.g., 635 mm/min). Conduct trial runs to ensure compatibility.

6. Clean the Connector

   After soldering, remove all fluxes, residues, and activators. Consult your solder and flux supplier for recommended cleaning solvents (refer to Figure 13 for compatible solvents). For Through-Hole Contacts: Direct a narrow stream of solvent through the receptacle, followed by a burst of pressurized, clean air to remove flux and residue.

7. Verify Installation and Key (Optional)

   Inspect all solder joints to ensure they conform to Workmanship Specification 101-21. Verify the connector housing is seated on the PC board within the specified tolerance (Figure 14). If keying is required, insert keying plug 86286-1 into the connector cavity with the small end first. Ensure the mating post is removed from the mating assembly.

Frequently Asked Questions about TE Connectivity